منابع مشابه
modification of nanoclay for improving the physico-mechanical properties of dental adhesives
هدف اصلی این مطالعه تهیه یک سامانه نوین چسب عاجی دندانی بر پایه نانورس پیوند شده با پلی متاکریلیک اسید، نانورس پیوند شده با پلی اکریلیک اسید، مخلوط نانوسیلیکا و نانورس پیوند شده با پلی متاکریلیک اسید، مخلوط نانوسیلیکا و نانورس پیوند شده با پلی اکریلیک اسید و نانورس پیوند شده با کیتوسان اصلاح شده با گلایسیدیل متاکریلات است. پیوند پلی متاکریلیک اسید و پلی اکریلیک اسید بر ری سطح نانورس در حضور و ...
Various Adhesives for Flip Chips
Flip chips using various adhesives were studied. The assembly yields using nonconductive adhesive and anisotropic conductive film investigated were 97% and 100%, respectively. A packaging process using anisotropic conductive paste with a 100% packaging yield was developed. All the packages passed various reliability tests such as burn in, artificial sweat and humidity tests, and temperature cyc...
متن کاملComfort model for automobile seat.
Comfort on automobile seats is lived daily by thousands of drivers. Epistemologically, comfort can be understood under the theory of complexity, since it emerges from a chain of interrelationships between man and several elements of the system. This interaction process can engender extreme comfort associated to the feeling of pleasure and wellbeing or, on the other hand, lead to discomfort, nor...
متن کاملThermal Modeling for Predication of Automobile Cabin Air Temperature
Thermal modeling of an automotive cabin was performed in this paper to predict the inside cabin air temperature. To implement this task, thermal and ventilation loads were estimated and the mass and energy balance conservation equations for dry air and water vapor with considering a new parameter (air circulation ratio) as well as the balance equations of internal components of a cabin were de...
متن کاملConductive Adhesives
S ince the advent of through-hole printed wiring boards in the 1950s, surface-mount technology has advanced through chip capacitors and resistors to high-density multilayer hybrids and printed circuit boards. Throughout this 40-year span, solder paste has been the accepted technology for component attach.' The present trend toward fine-pitch resolution ( t0.020") and multilayer constructions of...
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ژورنال
عنوان ژورنال: Kobunshi
سال: 1998
ISSN: 0454-1138,2185-9825
DOI: 10.1295/kobunshi.47.261